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Journal Of Micromechanics And Microengineering

Journal Of Micromechanics And MicroengineeringSCIE

國際簡稱:J MICROMECH MICROENG  參考譯名:微機(jī)械與微工程雜志

  • 中科院分區(qū)

    4區(qū)

  • CiteScore分區(qū)

    Q2

  • JCR分區(qū)

    Q2

基本信息:
ISSN:0960-1317
E-ISSN:1361-6439
是否OA:未開放
是否預(yù)警:否
TOP期刊:否
出版信息:
出版地區(qū):ENGLAND
出版商:IOP Publishing Ltd.
出版語言:English
出版周期:Monthly
出版年份:1991
研究方向:工程技術(shù)-材料科學(xué):綜合
評(píng)價(jià)信息:
影響因子:2.4
H-index:119
CiteScore指數(shù):4.5
SJR指數(shù):0.476
SNIP指數(shù):0.789
發(fā)文數(shù)據(jù):
Gold OA文章占比:13.91%
研究類文章占比:95.62%
年發(fā)文量:137
自引率:0.0434...
開源占比:0.0884
出版撤稿占比:0
出版國人文章占比:0.31
OA被引用占比:0.0241...
英文簡介 期刊介紹 CiteScore數(shù)據(jù) 中科院SCI分區(qū) JCR分區(qū) 發(fā)文數(shù)據(jù) 常見問題

英文簡介Journal Of Micromechanics And Microengineering期刊介紹

Journal of Micromechanics and Microengineering (JMM) primarily covers experimental work, however relevant modelling papers are considered where supported by experimental data.

The journal is focussed on all aspects of:

-nano- and micro- mechanical systems

-nano- and micro- electomechanical systems

-nano- and micro- electrical and mechatronic systems

-nano- and micro- engineering

-nano- and micro- scale science

Please note that we do not publish materials papers with no obvious application or link to nano- or micro-engineering.

Below are some examples of the topics that are included within the scope of the journal:

-MEMS and NEMS:

Including sensors, optical MEMS/NEMS, RF MEMS/NEMS, etc.

-Fabrication techniques and manufacturing:

Including micromachining, etching, lithography, deposition, patterning, self-assembly, 3d printing, inkjet printing.

-Packaging and Integration technologies.

-Materials, testing, and reliability.

-Micro- and nano-fluidics:

Including optofluidics, acoustofluidics, droplets, microreactors, organ-on-a-chip.

-Lab-on-a-chip and micro- and nano-total analysis systems.

-Biomedical systems and devices:

Including bio MEMS, biosensors, assays, organ-on-a-chip, drug delivery, cells, biointerfaces.

-Energy and power:

Including power MEMS/NEMS, energy harvesters, actuators, microbatteries.

-Electronics:

Including flexible electronics, wearable electronics, interface electronics.

-Optical systems.

-Robotics.

期刊簡介Journal Of Micromechanics And Microengineering期刊介紹

《Journal Of Micromechanics And Microengineering》自1991出版以來,是一本工程技術(shù)優(yōu)秀雜志。致力于發(fā)表原創(chuàng)科學(xué)研究結(jié)果,并為工程技術(shù)各個(gè)領(lǐng)域的原創(chuàng)研究提供一個(gè)展示平臺(tái),以促進(jìn)工程技術(shù)領(lǐng)域的的進(jìn)步。該刊鼓勵(lì)先進(jìn)的、清晰的闡述,從廣泛的視角提供當(dāng)前感興趣的研究主題的新見解,或?qū)彶槎嗄陙砟硞€(gè)重要領(lǐng)域的所有重要發(fā)展。該期刊特色在于及時(shí)報(bào)道工程技術(shù)領(lǐng)域的最新進(jìn)展和新發(fā)現(xiàn)新突破等。該刊近一年未被列入預(yù)警期刊名單,目前已被權(quán)威數(shù)據(jù)庫SCIE收錄,得到了廣泛的認(rèn)可。

該期刊投稿重要關(guān)注點(diǎn):

Cite Score數(shù)據(jù)(2024年最新版)Journal Of Micromechanics And Microengineering Cite Score數(shù)據(jù)

  • CiteScore:4.5
  • SJR:0.476
  • SNIP:0.789
學(xué)科類別 分區(qū) 排名 百分位
大類:Engineering 小類:Mechanical Engineering Q2 207 / 672

69%

大類:Engineering 小類:Mechanics of Materials Q2 146 / 398

63%

大類:Engineering 小類:Electrical and Electronic Engineering Q2 292 / 797

63%

大類:Engineering 小類:Electronic, Optical and Magnetic Materials Q2 118 / 284

58%

CiteScore 是由Elsevier(愛思唯爾)推出的另一種評(píng)價(jià)期刊影響力的文獻(xiàn)計(jì)量指標(biāo)。反映出一家期刊近期發(fā)表論文的年篇均引用次數(shù)。CiteScore以Scopus數(shù)據(jù)庫中收集的引文為基礎(chǔ),針對(duì)的是前四年發(fā)表的論文的引文。CiteScore的意義在于,它可以為學(xué)術(shù)界提供一種新的、更全面、更客觀地評(píng)價(jià)期刊影響力的方法,而不僅僅是通過影響因子(IF)這一單一指標(biāo)來評(píng)價(jià)。

歷年Cite Score趨勢圖

中科院SCI分區(qū)Journal Of Micromechanics And Microengineering 中科院分區(qū)

中科院 2023年12月升級(jí)版 綜述期刊:否 Top期刊:否
大類學(xué)科 分區(qū) 小類學(xué)科 分區(qū)
工程技術(shù) 4區(qū) ENGINEERING, ELECTRICAL & ELECTRONIC 工程:電子與電氣 INSTRUMENTS & INSTRUMENTATION 儀器儀表 NANOSCIENCE & NANOTECHNOLOGY 納米科技 PHYSICS, APPLIED 物理:應(yīng)用 4區(qū) 4區(qū) 4區(qū) 4區(qū)

中科院分區(qū)表 是以客觀數(shù)據(jù)為基礎(chǔ),運(yùn)用科學(xué)計(jì)量學(xué)方法對(duì)國際、國內(nèi)學(xué)術(shù)期刊依據(jù)影響力進(jìn)行等級(jí)劃分的期刊評(píng)價(jià)標(biāo)準(zhǔn)。它為我國科研、教育機(jī)構(gòu)的管理人員、科研工作者提供了一份評(píng)價(jià)國際學(xué)術(shù)期刊影響力的參考數(shù)據(jù),得到了全國各地高校、科研機(jī)構(gòu)的廣泛認(rèn)可。

中科院分區(qū)表 將所有期刊按照一定指標(biāo)劃分為1區(qū)、2區(qū)、3區(qū)、4區(qū)四個(gè)層次,類似于“優(yōu)、良、及格”等。最開始,這個(gè)分區(qū)只是為了方便圖書管理及圖書情報(bào)領(lǐng)域的研究和期刊評(píng)估。之后中科院分區(qū)逐步發(fā)展成為了一種評(píng)價(jià)學(xué)術(shù)期刊質(zhì)量的重要工具。

歷年中科院分區(qū)趨勢圖

JCR分區(qū)Journal Of Micromechanics And Microengineering JCR分區(qū)

2023-2024 年最新版
按JIF指標(biāo)學(xué)科分區(qū) 收錄子集 分區(qū) 排名 百分位
學(xué)科:ENGINEERING, ELECTRICAL & ELECTRONIC SCIE Q2 170 / 352

51.8%

學(xué)科:INSTRUMENTS & INSTRUMENTATION SCIE Q2 29 / 76

62.5%

學(xué)科:NANOSCIENCE & NANOTECHNOLOGY SCIE Q3 102 / 140

27.5%

學(xué)科:PHYSICS, APPLIED SCIE Q3 96 / 179

46.6%

按JCI指標(biāo)學(xué)科分區(qū) 收錄子集 分區(qū) 排名 百分位
學(xué)科:ENGINEERING, ELECTRICAL & ELECTRONIC SCIE Q3 200 / 354

43.64%

學(xué)科:INSTRUMENTS & INSTRUMENTATION SCIE Q3 46 / 76

40.13%

學(xué)科:NANOSCIENCE & NANOTECHNOLOGY SCIE Q3 82 / 140

41.79%

學(xué)科:PHYSICS, APPLIED SCIE Q3 106 / 179

41.06%

JCR分區(qū)的優(yōu)勢在于它可以幫助讀者對(duì)學(xué)術(shù)文獻(xiàn)質(zhì)量進(jìn)行評(píng)估。不同學(xué)科的文章引用量可能存在較大的差異,此時(shí)單獨(dú)依靠影響因子(IF)評(píng)價(jià)期刊的質(zhì)量可能是存在一定問題的。因此,JCR將期刊按照學(xué)科門類和影響因子分為不同的分區(qū),這樣讀者可以根據(jù)自己的研究領(lǐng)域和需求選擇合適的期刊。

歷年影響因子趨勢圖

發(fā)文數(shù)據(jù)

2023-2024 年國家/地區(qū)發(fā)文量統(tǒng)計(jì)
  • 國家/地區(qū)數(shù)量
  • CHINA MAINLAND249
  • USA121
  • Japan42
  • India38
  • South Korea36
  • GERMANY (FED REP GER)33
  • Canada27
  • Taiwan23
  • England19
  • France18

本刊中國學(xué)者近年發(fā)表論文

  • 1、Loss mechanisms of multi-frequency whispering gallery mode RF-MEMS resonators

    Author: Liu, Wenli; Chen, Zeji; Lu, Yujie; Zhao, Junyuan; Zhu, Yinfang; Yang, Jinling; Yang, Fuhua

    Journal: JOURNAL OF MICROMECHANICS AND MICROENGINEERING. 2023; Vol. 33, Issue 1, pp. -. DOI: 10.1088/1361-6439/ac8bde

  • 2、Remote actuation based on magnetically responsive pillar arrays

    Author: Jiang, Wei; Wang, Lanlan; Chen, Bangdao; Liu, Hongzhong

    Journal: JOURNAL OF MICROMECHANICS AND MICROENGINEERING. 2023; Vol. 33, Issue 1, pp. -. DOI: 10.1088/1361-6439/aca20f

  • 3、Fatigue life evaluation of gold wire bonding solder joints in MEMS pressure sensors

    Author: Zhang, Yunfan; Wu, Kangkang; Shen, Shengnan; Zhang, Quanyong; Cao, Wan; Liu, Sheng

    Journal: JOURNAL OF MICROMECHANICS AND MICROENGINEERING. 2023; Vol. 33, Issue 2, pp. -. DOI: 10.1088/1361-6439/aca913

  • 4、Topology optimization design of compliant amplification mechanisms with low parasitic displacement

    Author: Wang, Qiliang; Wei, Jianming; Long, Yiping; Tan, Jianping

    Journal: JOURNAL OF MICROMECHANICS AND MICROENGINEERING. 2023; Vol. 33, Issue 2, pp. -. DOI: 10.1088/1361-6439/aca4dc

  • 5、An ionic pressure sensor array with digitizable sensitivity

    Author: Zou, Qiang; Liu, Chenyu; Su, Qi; Xue, Tao

    Journal: JOURNAL OF MICROMECHANICS AND MICROENGINEERING. 2023; Vol. 33, Issue 5, pp. -. DOI: 10.1088/1361-6439/acc873

  • 6、Identification and suppression of driving force misalignment angle for a MEMS gyroscope using parametric excitation

    Author: Zheng, Xudong; Wang, Xuetong; Shen, Yaojie; Xia, Chenhao; Tong, Wenyuan; Jin, Zhonghe; Ma, Zhipeng

    Journal: JOURNAL OF MICROMECHANICS AND MICROENGINEERING. 2023; Vol. 33, Issue 5, pp. -. DOI: 10.1088/1361-6439/acbfc6

  • 7、Research on high temperature performance of pressure sensor

    Author: Zhao, Zhiqiang; Pan, Shuliang; Memon, Maria Muzamil; Liu, Qiong; Wang, Tao; Zhang, Wanli

    Journal: JOURNAL OF MICROMECHANICS AND MICROENGINEERING. 2023; Vol. 33, Issue 5, pp. -. DOI: 10.1088/1361-6439/acc6dd

  • 8、Developing a multi-sample acoustofluidic device for high-throughput cell aggregation

    Author: Yang, Renhua; Huang, Siping; Zhang, Yiwen; Zhang, Chao; Qian, Jingui; Lam, Raymond H. W.; Lee, Joshua E-Y; Wang, Zuankai

    Journal: JOURNAL OF MICROMECHANICS AND MICROENGINEERING. 2023; Vol. 33, Issue 5, pp. -. DOI: 10.1088/1361-6439/acbfc5

投稿常見問題

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